A review of electroless gold deposition processes

Characterization of the metal–semiconductor interface of gold contacts on CdZnTe formed by electroless deposition

Fully spectroscopic x/γ-ray imaging is now possible thanks to advances in the growth of wide-bandgap semiconductors. One of the most promising materials is cadmium zinc telluride (CdZnTe or CZT), which has been demonstrated in homeland security, medical imaging, astrophysics and industrial analysis applications. These applications have demanding energy and spatial resolution requirements that a...

Electroless Deposition and Electroplating of Metals

Characterization of parasitic residual deposition on passivation layer in electroless nickel immersion gold process

The problem of parasitic residual deposition on the passivation layer in electroless deposition process is studied in this paper. The characterization analysis tools involved are focused ion beam (FIB), scanning electron microscopy (SEM), electron dispersive Xray (EDX) and metallurgical interface analysis. Samples were identified as either good or bad prior to the characterization process via a...

The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition

This paper discusses on the surface characteristics of each of the seven set-up process steps prior completion of under bump metallurgy (UBM) deposition. The Atomic Force Microscopy (AFM) and Scanning Electron Microscopy (SEM) techniques were used to obtain the surface roughness and morphology of each deposition process. The elemental analysis using Energy Disperse X-Ray (EDX) and precision mic...

Optimizing Electroless Nickel Pretreatment Processes

The pretreatment of the substrate, prior to Electroless Nickel (EN) plating, plays an important role in the corrosion protection provided by the EN deposit. Many factors in the pretreatment process can affect the corrosion resistance of the EN deposit. The details of mechanical treatment, chemical/elecuo polishing, acid activation, and pre-processing procedure (such as nickel strike) are among ...